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Cap Down Pin Grid Array Module

IP.com Disclosure Number: IPCOM000062234D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gresko, AR: AUTHOR [+3]

Abstract

A precut polyimide film is utilized to bond a module cap to a ceramic substrate and to provide a corrosion barrier for the exposed circuit lines on the substrate that are outside the cap area. This package arrangement (cap down) also provides a significant thermal enhancement. The process is accomplished in the following manner.

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Cap Down Pin Grid Array Module

A precut polyimide film is utilized to bond a module cap to a ceramic substrate and to provide a corrosion barrier for the exposed circuit lines on the substrate that are outside the cap area. This package arrangement (cap down) also provides a significant thermal enhancement. The process is accomplished in the following manner.

A chip 1 is die bonded to a ceramic substrate 2 by means of a bonding material 3. Wirebonds 4 connect circuitry (not seen) on the substrate 2 to circuitry (not seen) on the chip 1. The polyimide film 5 is placed over the substrate 2. The film 5 has openings to accommodate pins 6 and chip 1. The substrate is then heated through a partial cure of the polyimide film 3 and the module cap 7 is placed on the film-coated substrate 2. The cap/substrate assembly is subjected to moderate pressure at an elevated temperature for the complete cure.

Disclosed anonymously.

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