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Browse Prior Art Database

Method for Applying Polyimide to Ceramic Substrates

IP.com Disclosure Number: IPCOM000062235D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Papathomas, KI: AUTHOR [+2]

Abstract

Polyimide is used as an insulating layer in the fabrication of multilayer electronic circuitry. Generally, a first layer of circuitry is fabricated on a substrate, a layer of polyimide is applied over the first layer of circuitry and then a second layer of circuitry is fabricated on top of the polyimide. Interconnection between the layers is achieved by means of vias that etched in the polyimide.

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Method for Applying Polyimide to Ceramic Substrates

Polyimide is used as an insulating layer in the fabrication of multilayer electronic circuitry. Generally, a first layer of circuitry is fabricated on a substrate, a layer of polyimide is applied over the first layer of circuitry and then a second layer of circuitry is fabricated on top of the polyimide. Interconnection between the layers is achieved by means of vias that etched in the polyimide.

The process of etching the vias is improved if the layer of polyimide is of uniform thickness and uniform cure. A more uniform layer of polyimide is obtained if the substrate is heated prior to and during the application of the polyimide.

Disclosed anonymously.

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