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Wire Bonding Capillary Tips for High Temperature Applications

IP.com Disclosure Number: IPCOM000062245D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hodgson, RT: AUTHOR [+2]

Abstract

A method has been proposed to make wire bonding capillary tips which may be used in high temperature applications without experiencing the severe oxidation of the tip which normally occurs in air. A silicide protective coating is used to protect the tip.

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Wire Bonding Capillary Tips for High Temperature Applications

A method has been proposed to make wire bonding capillary tips which may be used in high temperature applications without experiencing the severe oxidation of the tip which normally occurs in air. A silicide protective coating is used to protect the tip.

In the process both the inside and the outside of the capillary tip are provided with a layer of protective coating. Initially, a mandrel 1 is made having the required inner dimensions of the capillary tip. A layer 2 of WSi2, which will serve as the inner protective coating, is coated to the mandrel. A layer 3 of tungsten with the desired thickness is coated on top of layer 2. A second protective layer 4 of WSi2 is then coated over the tungsten 3. The mandrel is removed from the WSi2/W/WSi2 structure, leaving the final capillary tip. When heated in a thin layer of SiO2 forms on the tip which inhibits O2 diffusion and further oxidation, thereby prolonging service life.

Disclosed anonymously.

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