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Blister-free Lamination

IP.com Disclosure Number: IPCOM000062246D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Yardley, JV: AUTHOR

Abstract

A lamination method has been developed which utilizes additional release sheets for the top and bottom of laminates fabricated for semiconductor devices. The sliding effect thus realized eliminates wrinkling of the contact sheets and green sheets during lamination.

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Blister-free Lamination

A lamination method has been developed which utilizes additional release sheets for the top and bottom of laminates fabricated for semiconductor devices. The sliding effect thus realized eliminates wrinkling of the contact sheets and green sheets during lamination.

In the lamination process for thick multi-layer substrates, excessive wrinkles in the polyester release sheets 1, used as the top and bottom sheets in the lamination 2, caused severe depressions in the ceramic green sheets 3. It was determined that was caused by the polyester film sticking to both the punch face 4 and the ceramic sheet. During the lamination process the ceramic sheets are in contact with the punch face and the die 5. The ceramic sheets become an extension of the die, and being of soft pliable material, tend to deform easily.

During the shearing action when the punch enters the die, the bottom sheets are sheared larger than the die cavity. They are then forced into the die by deforming the polyester film. This, being rigid, causes depressions in the ceramic.

The new method suggests the addition of a second polyester sheet 6 to the top and bottom of the layers to be laminated. The use of two sheets of polyester film at the interface of the punch and ceramic green sheet creates an interface with the surfaces having the ability to slide, not stick. The maintenance of a smooth surface in this manner leads to a wrinkle-free laminate.

Disclosed anonymously.

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