Browse Prior Art Database

Composite Thin Film Recording Head

IP.com Disclosure Number: IPCOM000062254D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bonyhard, PI: AUTHOR

Abstract

A method is described for fabricating magnetic head sliders by utilizing thin wafers for fabricating the magnetic head elements followed by bonding to previously fabricated sliders at the row level.

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Composite Thin Film Recording Head

A method is described for fabricating magnetic head sliders by utilizing thin wafers for fabricating the magnetic head elements followed by bonding to previously fabricated sliders at the row level.

The magnetic read/write head is processed on thin wafers so that automated wafer handling equipment designed for silicon wafers can be used. Slider bodies are processed separately from the magnetic heads, and oriented so that the air bearing surfaces can be processed at the wafer level. The magnetic head is joined to the slider at the row level by field assisted glass bonding techniques.

Disclosed anonymously.

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