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Two-step Process to Fully Insulate a Ferrite Substrate

IP.com Disclosure Number: IPCOM000062256D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Aboaf, JA: AUTHOR [+4]

Abstract

Deposition followed by annealing comprise the two-step process for fully insulating a ferrite substrate and preventing shorting.

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Two-step Process to Fully Insulate a Ferrite Substrate

Deposition followed by annealing comprise the two-step process for fully insulating a ferrite substrate and preventing shorting.

When depositing an insulating thin film layer on the surface of a substrate such as ferrite, the substrate surface may have small pores or irregularities which are not filled in by the deposited layer, and the deposition process may result in the creation of pinholes, each preventing the layer from being fully insulating. A second step of annealing the material to oxidize the pinhole areas of the substrate effectively completes the insulation. With a ferrite substrate and a deposited thin film layer of alumina or nitride (to prevent uncontrolled oxidation of the ferrite, e.g., for a magnetic head), the structure is annealed in an atmosphere having oxygen (e.g., air) at a temperature of over 400 degrees centigrade (preferably about 650 deg centigrade) oxidizes the open pin-holes or pores and forms an insulating layer, thereby completing the insulation of the substrate.

Disclosed anonymously.

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