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Browse Prior Art Database

Component Detachment Device

IP.com Disclosure Number: IPCOM000062260D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chalco, PA: AUTHOR [+2]

Abstract

Surface-soldered components are quickly and easily removed without damage from their support by directing laser energy simultaneously to all solder joints while applying a detaching force.

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Component Detachment Device

Surface-soldered components are quickly and easily removed without damage from their support by directing laser energy simultaneously to all solder joints while applying a detaching force.

In the figure, tool 1 has openings 2 through which optical fibers 3 extend toward component leads 4 soldered to pads 5 on circuit board 6. The tool engages component 7 and attracts it by vacuum in channel 8. As the component is urged upwardly, laser energy is directed through fibers 3 from a source to simultaneously heat and melt the solder on pads 5. This permits component to then be lifted from the board. Fibers 3 can be bundled together and carry the laser energy to the tool from a remote location.

Disclosed anonymously.

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