Browse Prior Art Database

Component Soldering Process

IP.com Disclosure Number: IPCOM000062266D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Rohr, RL: AUTHOR

Abstract

Component attachment is simplified by using the excess solder on tinned leads for the bonding material at the lead-solder pad junction.

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This is the abbreviated version, containing approximately 100% of the total text.

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Component Soldering Process

Component attachment is simplified by using the excess solder on tinned leads for the bonding material at the lead-solder pad junction.

In the process, components having depending leads are fed into a tray of molten solder to tine the leads. A heated gripper then lifts the component from the tray and properly positions it on a fluxed circuit card for attachment. The gripper maintains the leads at soldering temperature and the lead ends each carry a small globule of molten solder to their respective card pads. The card is maintained at an elevated temperature below the soldering temperature.

Disclosed anonymously.

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