Browse Prior Art Database

Fluxless Soldering Method

IP.com Disclosure Number: IPCOM000062268D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Shi, L: AUTHOR

Abstract

The oxide surface layer formed on solder to be reflowed can be broken by thermal fatigue to permit molten solder beneath the surface to flow through the openings by compression and wet the joined material.

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Fluxless Soldering Method

The oxide surface layer formed on solder to be reflowed can be broken by thermal fatigue to permit molten solder beneath the surface to flow through the openings by compression and wet the joined material.

During solder reflow for joining a pair of members, the solder ball on one of the members is subjected alternately to successive cycles of melting and solidifying to crack the oxide layer by thermal fatigue. Thereafter, the second member is compressed into contact with the solder ball to force underlying molten solder through the cracks and join the second member. Compression is illustrated in the FIGURE where component lead 1 is urged by spring 2 into contact with solder ball 3 on pad 4.

Disclosed anonymously.

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