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Pressure Venting Ceramic Flatten Plate for 64mm Pretinned Modules

IP.com Disclosure Number: IPCOM000062277D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

White, LH: AUTHOR

Abstract

Solder preforms that serve as the sealing bands for the encapsulation of large modules require flattening before the encapsulation of the module. This flattening is typically accomplished by using a square ceramic plate (Figs. 1 and 2) which is placed over the preform prior to processing the module through a furnace cycle to flow the solder to encapsulate the module. During this furnace processing some of the modules develop leaks during the cap-join operation due to the pressure build-up that occurs when tight cap-to-substrate contact traps the expanding air within an assembly. The resulting leaks can be prevented through the use of a modified flatted plate that works as described in the following. The modified plate (Fig. 3) is of the same dimensions as the original plate except that small v-shaped protrusions are added.

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Pressure Venting Ceramic Flatten Plate for 64mm Pretinned Modules

Solder preforms that serve as the sealing bands for the encapsulation of large modules require flattening before the encapsulation of the module. This flattening is typically accomplished by using a square ceramic plate (Figs. 1 and
2) which is placed over the preform prior to processing the module through a furnace cycle to flow the solder to encapsulate the module. During this furnace processing some of the modules develop leaks during the cap-join operation due to the pressure build-up that occurs when tight cap-to-substrate contact traps the expanding air within an assembly. The resulting leaks can be prevented through the use of a modified flatted plate that works as described in the following. The modified plate (Fig. 3) is of the same dimensions as the original plate except that small v-shaped protrusions are added. These protrusions will deform the flattened solder sufficiently to allow the escape of air from the module during the subsequent module cap-join operation.

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