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Alternative Leaded Package for Surface-Mounted Components

IP.com Disclosure Number: IPCOM000062333D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Overfield, RB: AUTHOR [+2]

Abstract

The Alternate Leaded Package (ALP) shown in Figs. 1 and 2 is designed to combine the two advantages of present leaded packages for surface- mounted components (SMCs). These are 1) lead flexibility and 2) accessibility for rework. In addition to the above advantages, visual inspection of solder joints is also improved. Fig. 1 shows the general package arrangement. Fig. 2 shows the same package with guide pins molded as part of the main body. These pins allow package orientation and registration for automatic placement. The height of the package can be varied by changing Y and O, as shown in Fig. 3A. Fig. 3B shows a schematic form of "as molded" and "after lead forming" stages in manufacturing. The package can be used with screened paste process or modified wave solder process.

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Alternative Leaded Package for Surface-Mounted Components

The Alternate Leaded Package (ALP) shown in Figs. 1 and 2 is designed to combine the two advantages of present leaded packages for surface- mounted components (SMCs). These are 1) lead flexibility and 2) accessibility for rework. In addition to the above advantages, visual inspection of solder joints is also improved. Fig. 1 shows the general package arrangement. Fig. 2 shows the same package with guide pins molded as part of the main body. These pins allow package orientation and registration for automatic placement. The height of the package can be varied by changing Y and O, as shown in Fig. 3A. Fig. 3B shows a schematic form of "as molded" and "after lead forming" stages in manufacturing. The package can be used with screened paste process or modified wave solder process. In modified wave soldering, solder is deposited on pads, the component placed on the printed circuit board and reflowed to make the solder joints (Fig. 3C).

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