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Thermal Conduction Influence Methodology

IP.com Disclosure Number: IPCOM000062338D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Grawoig, BC: AUTHOR

Abstract

A methodology is described to determine the junction temperature of electronic component packages by considering the thermal influence factors of other components in close proximity to the module of interest. This technique can also be used to quantify the distance modules must be separated when the effects of adjacent modules cause one or more modules to exceed their allowable temperature specification limits. The methodology can be incorporated into the design process to establish adequate spacing requirements prior to building expensive hardware. The junction temperature of a module is defined by the following equation: (Image Omitted) For a given package in a prescribed system, natural convection environment, the only factor which influences the junction temperature (which can be changed) is T(s), the surface temperature.

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Thermal Conduction Influence Methodology

A methodology is described to determine the junction temperature of electronic component packages by considering the thermal influence factors of other components in close proximity to the module of interest. This technique can also be used to quantify the distance modules must be separated when the effects of adjacent modules cause one or more modules to exceed their allowable temperature specification limits. The methodology can be incorporated into the design process to establish adequate spacing requirements prior to building expensive hardware. The junction temperature of a module is defined by the following equation:

(Image Omitted)

For a given package in a prescribed system, natural convection environment, the only factor which influences the junction temperature (which can be changed) is T(s), the surface temperature. Experimental data was collected for a single component being powered up monitoring the heat dissipation by a distance onto the card. This data was then graphed to create a thermal footprint of the particular component. The temperature was measured by thermocouples from the center of the module's case, out along the board. The graphs of the experimental data fitted an exponentially declining curve. Verification of the methodology was done through using the footprints of the modules with known radial distances and calculating the expected case temperatures. These calculations were compared to experiment...