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Automatic Semiconductor Chip Electrical Test Probe Alignment System

IP.com Disclosure Number: IPCOM000062402D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Allard, HC: AUTHOR [+3]

Abstract

A method is provided for automatically detecting and correcting on- the-fly semiconductor chip electrical test probe pin to pad alignment and making probe position corrections based on feedback information received by a controller from certain alignment aid probes. Fig. 1 is a diagram of an electrical test probe alignment system 10 which features automatic test probe alignment aid feedback techniques for keeping test probe pins and chip pads in registration during electrical tests. The system includes a controller 11, typically a desk top computer, interfacing electrical bus 12, means for generating voltage and measurement currents 13, which are bussed to probe station 14 through an electrical bus 15 and connected to a probe pin system shown in Fig. 2.

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Automatic Semiconductor Chip Electrical Test Probe Alignment System

A method is provided for automatically detecting and correcting on- the-fly semiconductor chip electrical test probe pin to pad alignment and making probe position corrections based on feedback information received by a controller from certain alignment aid probes. Fig. 1 is a diagram of an electrical test probe alignment system 10 which features automatic test probe alignment aid feedback techniques for keeping test probe pins and chip pads in registration during electrical tests. The system includes a controller 11, typically a desk top computer, interfacing electrical bus 12, means for generating voltage and measurement currents 13, which are bussed to probe station 14 through an electrical bus 15 and connected to a probe pin system shown in Fig. 2. The controller 11 controls the movement of a wafer holder at the probe station 14, the movement of probe pin system 18, applies current/voltage to selected probe pins of the system 18 and measures current/voltage with an appropriate program or system of linked programs. Fig. 2 shows the probe station 14 in more detail. The station is made up of a base plate 16, wafer chuck 17, test probe pin system 18 and a probe card holder 19. The wafer chuck 17 can move up or down and rotate. The base plate 16, holding the wafer chuck 17, can move right or left and backward or forward. When a semiconductor wafer 20 is mounted on the wafer chuck 17, the automatic semiconductor chip electrical test probe alignment system utilizes many of the degrees of freedom provided to bring the test probe pin system 18 and pads (not shown) on...