Browse Prior Art Database

Wire Placement Solvent Lock

IP.com Disclosure Number: IPCOM000062436D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Solomon, JM: AUTHOR [+2]

Abstract

In the MULTIWIRE* circuitization of a substrate the wire has a tendency to spring-back after placement. This spring-back force increases as the polyimide cross-sectional area increases relative to the conductor area and can result in both placement errors and voids between the wire and the adhesive that bonds the wire to the substrate. Coating the wire with a solvent-sensitive adhesive provides an improved bond to the adhesive and significantly reduces spring-back. As seen in the drawing, a substrate 1 has an adhesive overlay 2 in which wire circuits 3 are embedded. To improve adhesion of wire circuits 3 to adhesive overlay 2, a solvent-sensitive wire adhesive 4, as seen in the blow-up in the drawing, coats the wire insulation 5 surrounding the conductor 6.

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Wire Placement Solvent Lock

In the MULTIWIRE* circuitization of a substrate the wire has a tendency to spring-back after placement. This spring-back force increases as the polyimide cross-sectional area increases relative to the conductor area and can result in both placement errors and voids between the wire and the adhesive that bonds the wire to the substrate. Coating the wire with a solvent-sensitive adhesive provides an improved bond to the adhesive and significantly reduces spring- back. As seen in the drawing, a substrate 1 has an adhesive overlay 2 in which wire circuits 3 are embedded. To improve adhesion of wire circuits 3 to adhesive overlay 2, a solvent-sensitive wire adhesive 4, as seen in the blow-up in the drawing, coats the wire insulation 5 surrounding the conductor 6. The panel surface is sprayed with an adhesive solvent that is compatible with adhesive, such as methylene chloride, methyl ethyl ketone, or isopropyl alcohol. The panel is covered with a TEFLON** fabric and placed in a vacuum-pressure laminator to both press the encapsulated wire tightly in place and to dry the adhesive. During the solvent wet stage the adhesive will soften and improve the bond of the wires to the adhesive and permit flow into void areas 7 under the wire to eliminate the voids. * Trademark of Kollmorgen Corporation. ** Trademark of E. I. du Pont de Nemours & Co.

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