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Surface-Soldered Component Removal and Replacement Machine Utilizing Infrared Heating and Shields

IP.com Disclosure Number: IPCOM000062481D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 13K

Publishing Venue

IBM

Related People

Vanderlee, KA: AUTHOR

Abstract

A machine and process are described which remove and replace individual surface-soldered components on a circuit board using infrared heat. The machine uses a ring-shaped infrared heater to reflow the solder joints of an individual surface-soldered component on a circuit board. This heating process may be used to either remove a component or put on a new component. A vacuum chuck is used to pick up a component during component removal and to place a component during component reattachment. Metallic shields are used to protect nearby components and nearby areas of the circuit board. An X-Y table is used to provide accurate alignment of the component leads to the pads on the circuit board. An operator puts new components into the vacuum chuck or removes old components from the vacuum chuck.

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Surface-Soldered Component Removal and Replacement Machine Utilizing Infrared Heating and Shields

A machine and process are described which remove and replace individual surface-soldered components on a circuit board using infrared heat. The machine uses a ring-shaped infrared heater to reflow the solder joints of an individual surface-soldered component on a circuit board. This heating process may be used to either remove a component or put on a new component. A vacuum chuck is used to pick up a component during component removal and to place a component during component reattachment. Metallic shields are used to protect nearby components and nearby areas of the circuit board. An X-Y table is used to provide accurate alignment of the component leads to the pads on the circuit board. An operator puts new components into the vacuum chuck or removes old components from the vacuum chuck. The X-Y table moves the circuit board to the appropriate, predetermined location depending on which component on the circuit board is to be removed or replaced. The infrared heater may be cycled on and off either automatically to predetermined times or manually, as required. Motion of the vacuum chuck to pick up or place a component may also be controlled automatically or manually. Vacuum chucks and shields are different for each component shape and may be changed in order to work on different component shapes. The operator applies liquid flux to component leads or circuit board pads before component removal and before component replacement. Intermediate and final cleaning of the flux may be required. Standard solvents may be used for this purpose. This would be a separate operation. Additional solder may be supplied to the solder joints of components to be reattached to the circuit board with this machine by "pretinning" the component leads by dipping them in a solder pot and applying a thick initial coating of solder. Other methods of holding a component and picking and placing a component may be substituted for the vacuum chuck. For exampl...