Browse Prior Art Database

Component Attachment Method

IP.com Disclosure Number: IPCOM000062564D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Chalco, PA: AUTHOR

Abstract

Component mounting on opposite sides of a circuit board can be done with greater efficiency by holding the board vertically and automatically picking and attaching components for both sides simultaneously. 2 p. Referring to Fig. 1, circuit board 1 has component attachment lands 2 on opposite sides that have been pretinned with solder. Flux (Image Omitted) is applied over the solder. With the board supported in a vertical position, oscillating robot arms 3, one on each side, operate concurrently to pick components 4 from supply magazines 5 and attach the components to the selected lands by solder reflow. A diagram of the component gripping tool on each robot arm is shown in Fig. 2. Components 4 are held against the tool body 6 by vacuum supplied through channel 7 from a source.

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Component Attachment Method

Component mounting on opposite sides of a circuit board can be done with greater efficiency by holding the board vertically and automatically picking and attaching components for both sides simultaneously. 2 p. Referring to Fig. 1, circuit board 1 has component attachment lands 2 on opposite sides that have been pretinned with solder. Flux

(Image Omitted)

is applied over the solder. With the board supported in a vertical position, oscillating robot arms 3, one on each side, operate concurrently to pick components 4 from supply magazines 5 and attach the components to the selected lands by solder reflow. A diagram of the component gripping tool on each robot arm is shown in Fig. 2. Components 4 are held against the tool body 6 by vacuum supplied through channel 7 from a source. Body 6 carries heating blades 8, each engaging component leads 9, that hold the leads against the solder pads. The blades are then heated until solder reflows at the pads to attach the leads. Thereafter, the blades are de-energized to permit solder solidification.

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