Browse Prior Art Database

Solder Ball Alignment Device

IP.com Disclosure Number: IPCOM000062716D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Curtis, DR: AUTHOR [+2]

Abstract

The figure illustrates a placement process of small solder balls 10 to a multi-layer ceramic surface solder device 11. The balls are very small (25 mils or less), and must be located and held to a template 13 having drilled holes smaller than the solder balls, and spaced apart to match the ceramic device electrical contacts.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Solder Ball Alignment Device

The figure illustrates a placement process of small solder balls 10 to a multi- layer ceramic surface solder device 11. The balls are very small (25 mils or less), and must be located and held to a template 13 having drilled holes smaller than the solder balls, and spaced apart to match the ceramic device electrical contacts.

By applying vacuum to the template 13, via an attached plenum 14, the balls are held in the holes in proper alignment. The ceramic device 11 can now be placed in contact with the balls and solder paste, previously screened on the ceramic device, will extract the balls when vacuum is removed. The ceramic device with balls attached, can now be placed on the printed circuit board.

The template 13 with vacuum also aids the installation of the balls, as the balls simply can be "spilled" over and fall into place on the template.

Disclosed anonymously.

1