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Non-wet Low Friction Coated Solder Apparatus

IP.com Disclosure Number: IPCOM000062730D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Emerick, AJ: AUTHOR [+2]

Abstract

Materials which are used in the handling of parts that undergo soldering must be resistant to various chemicals and be non- wetting to solder. Titanium works well in these situations but has other limitations. An alternative material that can be used is titanium nitride which has the additional advantage in that it can be applied as a coating to other materials which may be desired for a particular application.

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Non-wet Low Friction Coated Solder Apparatus

Materials which are used in the handling of parts that undergo soldering must be resistant to various chemicals and be non- wetting to solder. Titanium works well in these situations but has other limitations. An alternative material that can be used is titanium nitride which has the additional advantage in that it can be applied as a coating to other materials which may be desired for a particular application.

Titanium nitride can be sputtered (a preferred method) or evaporated on a wide variety of metals and alloys and is inert to both chemicals and, e.g., fluxes, and solder. It forms a hard, low coefficient of friction, surface which cannot be broken by normal usage.

One application is in a solder pot. Cast iron solder pots are commonly used in the soldering of substrates because the cast iron forms a fragile but effective barrier of carbon between the solder and the iron pot. This barrier, however, can be easily disturbed by cleaning the pot etc. A barrier layer of titanium nitride is more durable and permits a wide selection of metals for the titanium nitride to be coated to.

Disclosed anonymously.

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