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Technique for Analysis of Dielectric Coating Materials

IP.com Disclosure Number: IPCOM000062731D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Galus, RA: AUTHOR [+2]

Abstract

Microelectronic devices that are sensitive to alpha particles can be protected from the particles by the application of a surface polymer, e.g., polyimide. However, variations in surface chemistry result from this application and have resulted in adhe failure. A technique that quantifies the effects of adhesion promoters addresses this problem and is described here.

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Technique for Analysis of Dielectric Coating Materials

Microelectronic devices that are sensitive to alpha particles can be protected from the particles by the application of a surface polymer, e.g., polyimide. However, variations in surface chemistry result from this application and have resulted in adhe failure. A technique that quantifies the effects of adhesion promoters addresses this problem and is described here.

An alpha particle sensitive device is typically an Al2O3 substrate 1, as seen in the drawing, with an epoxy interface 2 to a Si chip 3. An alpha-absorbing polymer material 4 is tested by cutting the overlaying polymer 4 inside the wire bonds 5 along cut line 6.

The polymer material 4 is sheared and the adhesive strength quantified. For accurate test results the peripheral polymer (outside cut line 6) and wire bonds 5 must be removed prior to shear testing.

Disclosed anonymously.

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