Browse Prior Art Database

Pl Permalloy Planarization for Coil Plating

IP.com Disclosure Number: IPCOM000062751D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Erez, N: AUTHOR [+3]

Abstract

A method for making a thin film magnetic head is described in which a planar surface is provided for coil deposition.

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Pl Permalloy Planarization for Coil Plating

A method for making a thin film magnetic head is described in which a planar surface is provided for coil deposition.

The method first provides a first magnetic pole piece 1 by means of a nickel- iron electroplating process. A photoresist material is applied surrounding the magnetic pole piece and this resist material is exposed and developed to form a pedestal pattern 2 of about the same thickness as the magnetic pole piece thereby producing a substantially planar surface. The photoresist material is then hard baked. A first insulation layer is then formed which can also be formed of a photoresist material that is exposed, developed and hard baked. This process forms a planar area upon which the copper coil is produced by an electroplating process, for example. The remainder of the process for depositing a second insulation layer and deposition of the second magnetic pole piece is performed in the usual manner.

The planarization permits a thicker coil plating, and a narrow coil pitch can also be achieved.

Disclosed anonymously.

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