Browse Prior Art Database

System for Automatic Registration of Components During Soldering

IP.com Disclosure Number: IPCOM000062759D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Marks, HC: AUTHOR [+3]

Abstract

A method is described to cause electronic components to self-align on the circuit card during a soldering operation.

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This is the abbreviated version, containing approximately 100% of the total text.

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System for Automatic Registration of Components During Soldering

A method is described to cause electronic components to self-align on the circuit card during a soldering operation.

It is widely recognized in the electronics industry that during soldering, small components self-align if they are not constrained. Larger, heavier components, however, are prevented from self-aligning (moving) by gravity induced friction. This method insures self-alignment of all components by introducing controlled vibration or vertical movement to the assembly of the components and circuit p while the solder is molten. This small vertical motion allows the natural surface tension of the molten solder to pull the leads of the component into perfect alignment with the circuit pads to which they are being joined. The controlled vertical movement is induced both during initial soldering in an in-line vapor phase system and during repair operations after the solder has melted. The vertical motion can be created by a rotating eccentric shaft or a solenoid which contacts the underside of the belt or surface on which the panel or card is supported.

Anonymous.

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