Browse Prior Art Database

Hydraulic Solder Squeegee

IP.com Disclosure Number: IPCOM000062768D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DeRoos, A: AUTHOR [+4]

Abstract

Bridging between solder caps on neighboring circuit pads and differing heights of solder caps on pads that result form immersion soldering can be eliminated by subjecting the solder hot oil jet.

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Hydraulic Solder Squeegee

Bridging between solder caps on neighboring circuit pads and differing heights of solder caps on pads that result form immersion soldering can be eliminated by subjecting the solder hot oil jet.

Referring to the figure, substrate 1 with solder caps 2 on circuit pads (not shown) is inverted and immersed in hot oil bath 3 so that the pads are below the substrate. The temperature of the oil is higher than the melting point of the solder. The substrate is then moved adjacent and relative to nozzle 4, which is spaced a distance D below the substrate and from which a jet of pressurized hot oil is directed against the caps at an angle / with respect to the plane of the board. The nozzle width preferably equals or exceeds the width of the substrate and is o rectangular cross section. The oil jet pressure can be varied to control the thickness of the solder remaining on the pads.

Disclosed anonymously.

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