Browse Prior Art Database

Solder Mask Lamination

IP.com Disclosure Number: IPCOM000062774D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lazzarini, DJ: AUTHOR [+3]

Abstract

The vacuum lamination of photosensitive dry film solder masks to large, thick, printed circuit panels requires special processing techniques. One problem that occurs periodically during lamination is entrapped air bubbles and wrinkles over functional co circuitry, which results in reliability exposures. This occurrence is particularly severe with warped composites (panels).

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Solder Mask Lamination

The vacuum lamination of photosensitive dry film solder masks to large, thick, printed circuit panels requires special processing techniques. One problem that occurs periodically during lamination is entrapped air bubbles and wrinkles over functional co circuitry, which results in reliability exposures. This occurrence is particularly severe with warped composites (panels).

This problem is eliminated (inside the lamination chamber) by slightly increasing the distance between the composite and film, and by selectively increasing the temperature of the bottom platen. This prevents premature contact between the film and composite, which would cause entrapped air (bubbles) and wrinkles. The distance between the film and composite is increase removing the rubber diaphragm which is located on the bottom of the lamination chamber. The temperature of the bottom platen is increased by approximately 25OEC above that of the upper chamber. The selective temperature increase relaxes and flattens warped composites, so that premature contact of the film is eliminated. This process is currently being used by manufacturing to produce defect free, solder mask coated printed circuit composites.

Disclosed anonymously.

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