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Improved Air Flow in Environmental Chamber

IP.com Disclosure Number: IPCOM000062776D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Barbera, FJ: AUTHOR [+3]

Abstract

Uneven air flow in an environmental test chamber causes a wide variation in temperature resulting in non-uniform temperature stress testing of product. This problem is solved by the redirection of air in the manner described in the following.

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Improved Air Flow in Environmental Chamber

Uneven air flow in an environmental test chamber causes a wide variation in temperature resulting in non-uniform temperature stress testing of product. This problem is solved by the redirection of air in the manner described in the following.

A false ceiling in the test chamber contains multiple holes for air circulation. Air passes through the holes when driven by a fan housed above the false ceiling. These holes can be re- configured by selective plugging such that the air is redirected to alter air circulation. The plugging of the holes causes the air patterns to be changed and by experimenting with the possible configurations an air flow is arrived at that will cause the most uniform air flow.

The plugging of the holes is accomplished by using commercially available knockout plugs which can easily be inserted the holes and removed when desired.

Disclosed anonymously.

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