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Low Temperature Field Assisted Bonding of Lithium Silicate Glass And Glass Ceramics

IP.com Disclosure Number: IPCOM000062786D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Chapman, DW: AUTHOR [+3]

Abstract

Field assisted bonding is achieved for a lithium silicate glass and glass-ceramic and their thin films at N200 degrees C or lower. These materials are commercially available from Corning Glass Co. under the trade name Fotoform Glass and Fotoceram Glass-Ceramic. The Fotoform Glass is amorphous and photosensitive, while the Fotoceram is partially crystalline and more stable thermally.

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Low Temperature Field Assisted Bonding of Lithium Silicate Glass And Glass Ceramics

Field assisted bonding is achieved for a lithium silicate glass and glass- ceramic and their thin films at N200 degrees C or lower. These materials are commercially available from Corning Glass Co. under the trade name Fotoform Glass and Fotoceram Glass-Ceramic. The Fotoform Glass is amorphous and photosensitive, while the Fotoceram is partially crystalline and more stable thermally.

The Fotoform Glass plate (1.3 mm thick) can be bonded to, e.g., Al or Al/Ti overcoated Si substrates routinely at 160 degrees C or lower under the influence of 500V or more electric potential for N5 min. Similar results were obtained for the Fotoceram Glass, except the bonding temperature is slightly higher (200 degrees C). The thickness of the Al and Ti films used are 0.2 to 1 and 0.02 micron, respectively. The thin Ti layer is used to increase the adhesion of Al film to the substrates. Without this Ti underlayer the bonded specimen can be separated at the interface. At T < 200OEc, Fotoform Glass can also be bonded to hafnium and magnesium films coated on substrates, thus joining the Fotoform Glass plate to the coated substrate.

Practically any similar or dissimilar surfaces can be bonded at a temperature much lower than 200 degrees C using Fotoform Glass thin film and Al/Ti thin film as interlayers. This glass thin film, typically few microns thick, is deposited by RF magnetron sputtering from a Fot...