Browse Prior Art Database

Wafer Clamping Assembly

IP.com Disclosure Number: IPCOM000072877D
Original Publication Date: 1970-Oct-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Hecker, EP: AUTHOR [+3]

Abstract

A mounting block is held at three points within a clamping assembly to support and position a semiconductor wafer during a dicing operation. The mounting block 20 is circular except for a flat portion 22. The block is positioned in a frame 24 including a fixed positioning bar 26 and a movable centering clamp 28. The clamp slides along transfer bars 30, 30'. The clamp is urged in one direction, by a bellows 32 and springs 34, 34' retract the centering clamp after the bellows pressure is released.

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Wafer Clamping Assembly

A mounting block is held at three points within a clamping assembly to support and position a semiconductor wafer during a dicing operation. The mounting block 20 is circular except for a flat portion 22. The block is positioned in a frame 24 including a fixed positioning bar 26 and a movable centering clamp
28. The clamp slides along transfer bars 30, 30'. The clamp is urged in one direction, by a bellows 32 and springs 34, 34' retract the centering clamp after the bellows pressure is released.

The block 20 has a step shaped profile. The clamp includes a portion which rides over the step portion. The positioning bar 26 includes an indentation which is shaped to provide tangential contact with the block at two points. The block is held in the clamped position at the tangential points and the clamp 28 when the latter is operated by the bellows. Release of the bellows causes the springs to withdraw the clamping member from the wafer.

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