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High Adhesion Copper Platings

IP.com Disclosure Number: IPCOM000073368D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Dougherty, WE: AUTHOR [+2]

Abstract

Strongly adhered copper plating deposits (pull test: 5 to 16 lbs/inch) are formed directly upon insulative surfaces by this procedure. Starting with a part containing an insulative surface to be copper clad (for example an epoxy glass surface): a) Pretreat with a chromic-sulfuric acid immersion and sensitize the part surface in preparation for standard electroless copper plating. b) With the part surface in contact with means for effecting connection to a source of cathode voltage, immerse the Part in an electroless plating solution in a tank containing an anode connectable to the same source. c) After 12-17 seconds of electroless plating in the solution, apply 2 to 3 ASF plating current to the electrode system formed by the part and anode.

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High Adhesion Copper Platings

Strongly adhered copper plating deposits (pull test: 5 to 16 lbs/inch) are formed directly upon insulative surfaces by this procedure. Starting with a part containing an insulative surface to be copper clad (for example an epoxy glass surface): a) Pretreat with a chromic-sulfuric acid immersion and sensitize the part surface in preparation for standard electroless copper plating. b) With the part surface in contact with means for effecting connection to a source of cathode voltage, immerse the Part in an electroless plating solution in a tank containing an anode connectable to the same source. c) After 12-17 seconds of electroless plating in the solution, apply 2 to 3 ASF plating current to the electrode system formed by the part and anode. d) Plate electrolytically in the same bath with the same solution increasing plating current by 2-5 ASF every minute until current reaches 20-30 ASF; then plate at fixed current, such as 50-80 ASF. In 15 minutes a 1 mil thickness of deposit is formed. e) Rinse, dry and bake.

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