Browse Prior Art Database

Surface Temperature Measurement Probe

IP.com Disclosure Number: IPCOM000073382D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Carroll, PM: AUTHOR [+2]

Abstract

During solder reflow bonding of integrated circuit chips to ceramic substrates, it is conventional to position a thermocouple near a substrate surface to monitor substrate temperature during reflow. More accurate results are obtained by incorporating the thermocouple into a substrate, with a solder land serving to connect the two dissimilar metal wires of the thermocouple.

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Surface Temperature Measurement Probe

During solder reflow bonding of integrated circuit chips to ceramic substrates, it is conventional to position a thermocouple near a substrate surface to monitor substrate temperature during reflow. More accurate results are obtained by incorporating the thermocouple into a substrate, with a solder land serving to connect the two dissimilar metal wires of the thermocouple.

Shown is a ceramic substrate 10 of the type on which a semiconductor chip is normally mounted. A solder wettable pattern for subsequent deposition of solder on substrate 10 is screened on the substrate surface. In place of two of the contact pins normally inserted through the substrate, two dissimilar metal thermocouple wires 14 and 16 (which may be copper and constant or two dissimilar noble metals) are provided in contact with the pattern on substrate 10. The substrate is dipped in solder to provide solder land I2 corresponding to the previously screened solder wettable pattern and in electrical contact with thermocouple wires 14 and 16. If desired, the solder land pattern may be modified to provide a plurality of positive thermocouple wires electrically connected to a common negative thermocouple wire.

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