Browse Prior Art Database

Adhesiveless Multilayer Circuit

IP.com Disclosure Number: IPCOM000073385D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Carl, HP: AUTHOR

Abstract

A multilayer circuit package which provides for individually personalized circuits on each layer and for through connections from layer to layer can be fabricated without adhesive and without plated through holes, utilizing a number of discrete, separately manufactured layers which can be formed into a laminate by solder reflow.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 80% of the total text.

Page 1 of 2

Adhesiveless Multilayer Circuit

A multilayer circuit package which provides for individually personalized circuits on each layer and for through connections from layer to layer can be fabricated without adhesive and without plated through holes, utilizing a number of discrete, separately manufactured layers which can be formed into a laminate by solder reflow.

Each layer of the laminate consists of a copper-clad dielectric in which the copper 10 and dielectric 12 layers have been selectively etched. This step provides "personality" to the copper layer 10 defining various circuit paths, and cavities 14 in the dielectric layer to provide for connections from one layer to the next in the laminate.

Wherever there is to be a connection from one layer to the layer above it, a compensating button 16 of copper is deposited on layer 10 and wherever a connection is to be made to the layer below, a compensating copper insert 18 is deposited within cavity 14. The buttons and inserts 16, 18 are coated with solder 20, 22. Thus, when a button 16 is inserted into a cavity 14, its layer of solder 20 can be joined to the receiving cavity layer of solder 22 by solder reflow effected by simple heat and pressure.

By a series of such cavities and buttons, a through connection can extend through many layers of the laminate to provide an electrical path all the way through the laminate or to or between any planes within it. To provide mechanical strength, additional through connections...