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Browse Prior Art Database

Lapping Slurry

IP.com Disclosure Number: IPCOM000073411D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Miller, JG: AUTHOR [+2]

Abstract

The lapping of parts particularly a combination of hard and soft materials (i.e., alumina - copper) is accomplished using a slurry containing a mixture of a cutting and a noncutting abrasive.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Lapping Slurry

The lapping of parts particularly a combination of hard and soft materials
(i.e., alumina - copper) is accomplished using a slurry containing a mixture of a cutting and a noncutting abrasive.

The lapping of ceramic parts uses a combination of a hard cutting abrasive such as silicon carbide and a soft abrasive such as alumina in a slurry of terpineol. The alumina acts as a lubricant and leveler. In addition, the alumina cleans the surface by abrasion and serves as a carrier of the lapped material from the lapped surface. The lapping rate is controlled by the relative proportions of each abrasive in the slurry and the particle size of the silicon carbide is chosen to be larger than the particle size of the alumina. The slurries can contain by weight: 10-50% - 17u SiC and 50-90% 12u HL(2)O(3) with from 10-75% solids concentration in terpineol.

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