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Browse Prior Art Database

Thermal Connection for Circuit Package

IP.com Disclosure Number: IPCOM000073475D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Donegan, MJ: AUTHOR

Abstract

This electronic circuit package comprises printed circuit boards 10 & 11 with circuit elements 12 such as modules mounted on a support plate 13 formed to have cylindrical end rods 14 & 15 insertable within spring clips 16 & 17 attached to frame members 18 & 19, respectively. Support plate 13 is made of thermally conductive material and the cylindrical end rods 14 and 15 are preferably formed as integral parts of the plate. Printed circuit boards 11 & 12 are attached to support plate preferably by surface bonding so that good thermal contact is made for heat flow to occur through plate 13 to end rods 14 & 15. Spring clips 16 & 17 are made of thermally conductive material such as metal, so that heat from rods 14 & 15 is conducted through clips 16 & 17 to frame members 18 & 19 which may be part of a heat sink.

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Thermal Connection for Circuit Package

This electronic circuit package comprises printed circuit boards 10 & 11 with circuit elements 12 such as modules mounted on a support plate 13 formed to have cylindrical end rods 14 & 15 insertable within spring clips 16 & 17 attached to frame members 18 & 19, respectively. Support plate 13 is made of thermally conductive material and the cylindrical end rods 14 and 15 are preferably formed as integral parts of the plate. Printed circuit boards 11 & 12 are attached to support plate preferably by surface bonding so that good thermal contact is made for heat flow to occur through plate 13 to end rods 14 & 15. Spring clips 16 & 17 are made of thermally conductive material such as metal, so that heat from rods 14 & 15 is conducted through clips 16 & 17 to frame members 18 & 19 which may be part of a heat sink. The spring clips 16 & 17 are sectioned by grooves 20 to provide greater surface contact with the end rods 14 & 15 to provide improved thermal conduction to frame member 18 & 19. Rods 14 & 15 may take some form providing spring clips 16 & 17 are given corresponding shape to maximize surface contact therebetween. In the alternative arrangement of Figure B, the clip 22 may be bonded to the ends of plate 13 and the mounting rod 23 is an integral extension of the wall surface of frame members 18 (not shown) and 19.

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