Browse Prior Art Database

Dicing Device

IP.com Disclosure Number: IPCOM000073492D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Budin, AN: AUTHOR

Abstract

This device, used for dicing wafers bonded on phenolic carriers to obtain chips, comprises two cutting elements E1 and E2, each of which involves a plurality of cutting discs with interspersed spacers. For each element, all the discs are rigidly mounted on a shaft and the spindles of the two shafts are parallel to each other and balanced.

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Dicing Device

This device, used for dicing wafers bonded on phenolic carriers to obtain chips, comprises two cutting elements E1 and E2, each of which involves a plurality of cutting discs with interspersed spacers. For each element, all the discs are rigidly mounted on a shaft and the spindles of the two shafts are parallel to each other and balanced.

The wafers W are mounted on a four position indexer 1, with each position being able to carry a "phenolic carrier + wafer" set. Furthermore, the indexer I can effect four controlled 90 degree rotations. (The control of such rotation is not shown). Consequently, each phenolic carrier and wafer set will be successively placed on four positions during a complete cycle, that is: two positions A and B for dicing, one position C for wafer cleaning and one position D for loading and unloading.

During the operation, the indexer 1 makes a complete four step rotation so that the wafers W, after loading, are disposed before the first cutting element E1 which cuts the wafer into first strips and then, before the second cutting element E2, after a 90 degrees rotation, which cuts the wafer into second strips perpendicular to the first strips. For each cutting step, the indexer is pushed towards the cutting elements E1 and E2 by a control device, not shown. After passing before the two cutting elements, each wafer comprises a plurality of chips, which can be rectangular or square according to whether the spacers have the same "in...