Browse Prior Art Database

Silver Palladium Interface Between Copper and Ceramic

IP.com Disclosure Number: IPCOM000073497D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

McBride, DG: AUTHOR [+2]

Abstract

Improved adhesion between a ceramic substrate and a copper film can be obtained by performing one of the following methods: METHOD #1

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Silver Palladium Interface Between Copper and Ceramic

Improved adhesion between a ceramic substrate and a copper film can be obtained by performing one of the following methods: METHOD #1

A silver palladium paste is dispersed in an organic vehicle such. as toluene or acetone to a liquid consistency. The ceramic substrate is dip coated with the silver palladium liquid and fired at about 800 degrees C in an argon atmosphere. The coated substrate is sensitized with SnCl(2)-PdCl(2) or with NaBH(4). Copper is then electrolessly deposited followed by the electrolytic deposition of copper. A desired circuit can be prepared in the normal manner. METHOD #2

The substrate is activated SnCl(2)-PdCl(2) to obtain a noticeable layer of Pd. A silver layer is then electrolessly deposited and is followed by the electrolytic deposition of a copper layer. METHOD #3

The substrate is dip coated in a liquid having a molybdenum manganese paste dispersed therein and is fired at 800 degrees C in an argon atmosphere. As in method #1, the coated substrate is activated with SnCl(2)-PdCl(2) or with NaBH(4) and in sequence copper is deposited thereon electrolessly and then electrolytically.

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