Browse Prior Art Database

Chemical Mechanical Polishing

IP.com Disclosure Number: IPCOM000073507D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hutchinson, MA: AUTHOR [+2]

Abstract

This method provides mechanical polishing of flat surfaces by utilizing a surface limited chemical reaction to provide an easily removable reaction product.

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Chemical Mechanical Polishing

This method provides mechanical polishing of flat surfaces by utilizing a surface limited chemical reaction to provide an easily removable reaction product.

An embodiment of the method is illustrated by the following example for polishing copper plates. Plates to be polished are placed in a chemical solution comprising the following.: - Potassium Iodide 8 grams Iodine 3 grams Citric Acid 11 grams Water up to 1 liter.

A plain cloth-covered rotating disc is used to remove the resulting copper iodide which forms on the surface of the copper plate. Because the reaction is surface limited, only high spots are removed until the plate is polished flat.

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