Browse Prior Art Database

RF Cathode for Ion Plating

IP.com Disclosure Number: IPCOM000073509D
Original Publication Date: 1970-Dec-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bertelsen, BI: AUTHOR

Abstract

This method eliminates the need for a grounded grid between anode and cathode in ion plating of dielectrics, as suggested by D. M. Mattox in U.S. Patent 3,329,601.

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RF Cathode for Ion Plating

This method eliminates the need for a grounded grid between anode and cathode in ion plating of dielectrics, as suggested by D. M. Mattox in U.S. Patent 3,329,601.

An RF cathode is mounted directly behind the cathode-substrate in an ion plating apparatus to more efficiently ion plate dielectrics on the substrate. The RF cathode accomplishes resputtering during deposition and eliminates shadowing and positioning problems encountered when using a grid.

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