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Browse Prior Art Database

Corrosion Resistant Aluminum Copper Alloys

IP.com Disclosure Number: IPCOM000073539D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Farrar, PA: AUTHOR [+2]

Abstract

The alloys described provide corrosion resistant conductors useful in semiconductor device manufacturing.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Corrosion Resistant Aluminum Copper Alloys

The alloys described provide corrosion resistant conductors useful in semiconductor device manufacturing.

Small amounts of cadmium, zinc or silicon, in amounts less than 1 per cent by weight, or magnesium, in an amount greater than 1 per cent by weight, when added to aluminum-copper alloys will increase the corrosion resistance of the alloy. The ternary alloys may be prepared by sequential or alloy evaporation of the desired constituents onto a substrate. After deposition, a homogenization treatment is used to provide the proper stage of precipitation which will effectively oppose corrosion. This is achieved by heating the evaporated metals to as high a temperature as can be used without excessive alloying with the substrate. For example, for a silicon substrate, a heat treatment of 350-475 degrees C. for 30 minutes to two hours may be used.

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