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Browse Prior Art Database

Adhesion of Metal Films

IP.com Disclosure Number: IPCOM000073555D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Altman, C: AUTHOR [+3]

Abstract

Adhesion between different thin films or between thin films and substrates is improved by irradiating the substrate with electrons immediately prior to and during vacuum deposition of the film.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Adhesion of Metal Films

Adhesion between different thin films or between thin films and substrates is improved by irradiating the substrate with electrons immediately prior to and during vacuum deposition of the film.

Copper films were deposited on thermal SiO(2) at a substrate temperature of 25 degrees C. Electron energy was 1000V and current about 200U A/cm/2/.

Adhesion measured by "Peel Test" methods required a force of 10 grams/cm width to peel irradiated copper films and 3 grams/cm width for nonirradiated Cu films.

These process conditions serve only as a specific example applicable to copper films and are not limitations.

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