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Removing Bonded Epoxy From Aluminum

IP.com Disclosure Number: IPCOM000073660D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kryzaniwsky, BR: AUTHOR

Abstract

In the manufacture of electronic products, circuit boards are sometimes bonded to aluminum frames by using epoxy. Occasionally, failures occur and it is necessary to salvage the components by removing the epoxy from the aluminum frame. It is possible to remove the epoxy by conducting heat through the aluminum frame. When the surface of the aluminum reaches the ultimate temperature of 210 degrees, the bond strength of the oxidized aluminum layer is decreased to a point where the circuit card can be pulled free from the aluminum surface. The original epoxy remains on the circuit card thus leaving the aluminum surface free of epoxy.

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Removing Bonded Epoxy From Aluminum

In the manufacture of electronic products, circuit boards are sometimes bonded to aluminum frames by using epoxy. Occasionally, failures occur and it is necessary to salvage the components by removing the epoxy from the aluminum frame. It is possible to remove the epoxy by conducting heat through the aluminum frame. When the surface of the aluminum reaches the ultimate temperature of 210 degrees, the bond strength of the oxidized aluminum layer is decreased to a point where the circuit card can be pulled free from the aluminum surface. The original epoxy remains on the circuit card thus leaving the aluminum surface free of epoxy.

Three different types of heating sources can be used to conduct heat to the aluminum frame: infrared lamp, hot plate and high-frequency induction coil.

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