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Etched Braze Preform Sheet

IP.com Disclosure Number: IPCOM000073675D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Koop, DA: AUTHOR [+2]

Abstract

An etched preform sheet is employed in brazing solder bucket connectors to metallized ceramic circuit module substrates to assure uniform alignment of braze preforms over each metallized pad.

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Etched Braze Preform Sheet

An etched preform sheet is employed in brazing solder bucket connectors to metallized ceramic circuit module substrates to assure uniform alignment of braze preforms over each metallized pad.

In A, a square grid array is etched using photoresist methods from brazing alloy sheet stock in fabricating the preform. Sheet 10 is placed on the surface of a ceramic module 11 having conductor filled vias and lines 12, 13. Each disc 14, 15 on sheet 10 is placed such that it is vertically aligned with corresponding metallized pads 16, 17 on the module. The metallized pads may be electroless plated nickel.

The braze alloy is then reflowed by heating. During the reflow, the alloy flows to the metallized pads and does not wet the ceramic material. This provides a uniform deposit of braze alloy on each pad which is subsequently employed to bond solder buckets or conductor pins to the module.

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