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Bulge Forming for Pinning Machine

IP.com Disclosure Number: IPCOM000073698D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Gery, JC: AUTHOR [+2]

Abstract

A method of attaching a metallic contact pin 12 on an apertured ceramic substrate 11 comprises the following steps: A support punch 10 slidably mounted in a head, not shown, moves downwardly forcing the pin 12 through the hole in substrate 11. Then a heading ram drives the punch 10 to force the end of the pin to be shaped onto an anvil 13 and thus form a head 14 on the pin. Subsequently the bulge 15 is formed by applying a force to the pin along the longitudinal axis thereof, by actuating punch 10; the bushing 16, the anvil and the ceramic substrate being motionless. This step, A, is the conventional way, except that the ceramic substrate is not motionless, for head and bulge forming in pinning machines.

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Bulge Forming for Pinning Machine

A method of attaching a metallic contact pin 12 on an apertured ceramic substrate 11 comprises the following steps: A support punch 10 slidably mounted in a head, not shown, moves downwardly forcing the pin 12 through the hole in substrate 11. Then a heading ram drives the punch 10 to force the end of the pin to be shaped onto an anvil 13 and thus form a head 14 on the pin.

Subsequently the bulge 15 is formed by applying a force to the pin along the longitudinal axis thereof, by actuating punch 10; the bushing 16, the anvil and the ceramic substrate being motionless. This step, A, is the conventional way, except that the ceramic substrate is not motionless, for head and bulge forming in pinning machines.

Now the bulge is reshaped 15' by a vertical action of the bushing 16, to increase the volume of material against the ceramic substrate as seen in B. In this step the punch 10, the anvil 13 and the ceramic substrate 11 are motionless. This second step may be used to reforge the head 14 if so desired.

This second step provides better attachment of contact pins to their ceramic substrates, and permits the use of hard metallic pins without any special problems.

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