Browse Prior Art Database

Selective Stripping of Gold

IP.com Disclosure Number: IPCOM000073711D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-22
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Greame, WH: AUTHOR [+4]

Abstract

The drawing shows a connector 2 having tines 3 that are to receive a heavy plating of gold. Regions 4, where a solder joint is to be made, are to receive a thinner layer of gold to avoid contamination of the solder joint.

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Selective Stripping of Gold

The drawing shows a connector 2 having tines 3 that are to receive a heavy plating of gold. Regions 4, where a solder joint is to be made, are to receive a thinner layer of gold to avoid contamination of the solder joint.

Part 2 is first given a heavy layer of gold on all its surfaces. A mask 5 of plastic is placed over tines 3, and connector 2 is mounted on a holder 6. Holder 6 has rows of holes 7 for holding several connectors 2. With the tines 3 masked, the exposed regions 4 of part 2 are etched to reduce the gold thickness to a desired value.

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