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Browse Prior Art Database

Removable Encapsulation for Modules or Cards

IP.com Disclosure Number: IPCOM000073766D
Original Publication Date: 1971-Jan-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Eisenmann, DE: AUTHOR [+2]

Abstract

In the manufacture of electronic circuit modules or cards in air cooled systems, it has become increasingly more important to provide a means for repairing by removal and replacement of defective individual components after they have been encapsulated. A suitable encapsulant capable of solvent removal without damaging operative components is Dow Corning 630 Protective Coating. Not only does this material provide adequate characteristics for module or card operation, but it may safely be removed by agitation in solvents such as trichloroethylene, perchloroethylene, toluene, xylene, or other aromatic solvent without producing undesirable by-products which might damage operative components.

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Removable Encapsulation for Modules or Cards

In the manufacture of electronic circuit modules or cards in air cooled systems, it has become increasingly more important to provide a means for repairing by removal and replacement of defective individual components after they have been encapsulated. A suitable encapsulant capable of solvent removal without damaging operative components is Dow Corning 630 Protective Coating. Not only does this material provide adequate characteristics for module or card operation, but it may safely be removed by agitation in solvents such as trichloroethylene, perchloroethylene, toluene, xylene, or other aromatic solvent without producing undesirable by-products which might damage operative components.

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