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Multiple Via Punch

IP.com Disclosure Number: IPCOM000073816D
Original Publication Date: 1971-Feb-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Lucas, CJ: AUTHOR [+4]

Abstract

This multiple via punch simultaneously punches a great number of small holes in appropriate materials used as semiconductor substrates and other applications. Each wire punch is clamped in a pin vise which is mounted in a plunger. All plungers with the wire punch and pin vise are free to move in a vertical direction in the actuator ram. Plungers are tension biased against the actuation ram and held in the same relative position. The ram is actuated by a suitable means in a vertical direction. The wire punch is supported in stationary tubes held in position at each end of the tube. Any number of selected holes may be punched in the matrix by using the proper interposer selector plate. The multiple punch guide serves as a pressure plate.

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Multiple Via Punch

This multiple via punch simultaneously punches a great number of small holes in appropriate materials used as semiconductor substrates and other applications. Each wire punch is clamped in a pin vise which is mounted in a plunger. All plungers with the wire punch and pin vise are free to move in a vertical direction in the actuator ram. Plungers are tension biased against the actuation ram and held in the same relative position. The ram is actuated by a suitable means in a vertical direction. The wire punch is supported in stationary tubes held in position at each end of the tube. Any number of selected holes may be punched in the matrix by using the proper interposer selector plate. The multiple punch guide serves as a pressure plate. It is suspended on two parallel flexure plates and lowered on the interposer plate or substrate piece before the punches are actuated. The pressure plate, interposer plate, substrate piece and dieblock are clamped together in accurate alignment before punching. Positive end stop is provided for each wire punch to insure that leading edge of the punch travels beyond the full length of the die hole in the die bushing.

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