Browse Prior Art Database

Module Repair Tool

IP.com Disclosure Number: IPCOM000073854D
Original Publication Date: 1971-Feb-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Frisbie, RC: AUTHOR [+2]

Abstract

This is a desoldering tool and module removal device especially adapted for removing and replacing damaged modules of printed circuit cards, or the like. The desoldering tool 1 comprises a head 2, including a heating element, and having a matrix array of protrusions 3 designed to cooperate with module 4 pin connections to reflow the solder attachments of the modules to a printed circuit card 5.

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Module Repair Tool

This is a desoldering tool and module removal device especially adapted for removing and replacing damaged modules of printed circuit cards, or the like. The desoldering tool 1 comprises a head 2, including a heating element, and having a matrix array of protrusions 3 designed to cooperate with module 4 pin connections to reflow the solder attachments of the modules to a printed circuit card 5.

The module removal tool 6 comprises a body including two opposing module grippers 7 in a normally biased apart state. The module removal tool 6 is operated by placing the module grippers 7 over the module 4 and then sliding a slidable sleeve 8 toward the module. This causes the grippers 7 to engage and firmly hold the module element. After the solder pin attachments have been reflowed, the module removal tool 6 can pull the module device 4 from the printed circuit card 5.

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