Browse Prior Art Database

Ultrasonic Bonding At High Temperature

IP.com Disclosure Number: IPCOM000073878D
Original Publication Date: 1971-Feb-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Hochli, UT: AUTHOR [+2]

Abstract

A LINbo(3) transducer and a quartz sample were mounted into an ultrasonic transmitter-receiver system with about 1/2 mm of borax powder, a new bonding material, between transducer and sample. The received signal was at 40 db above receiver noise. Waves scattered from defects (side walls) could be clearly distinguished from waves scattered from the end face, due to their different traveling time. The insertion loss of the same arrangement measured at room temperature with grease bonding, is 75 db.

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Ultrasonic Bonding At High Temperature

A LINbo(3) transducer and a quartz sample were mounted into an ultrasonic transmitter-receiver system with about 1/2 mm of borax powder, a new bonding material, between transducer and sample. The received signal was at 40 db above receiver noise. Waves scattered from defects (side walls) could be clearly distinguished from waves scattered from the end face, due to their different traveling time. The insertion loss of the same arrangement measured at room temperature with grease bonding, is 75 db.

The insertion loss was measured as a function of transducer frequency and sample temperature. The results are plotted in the table.

The Figure shows an ultrasonic echo pattern taken with a e cm long quartz, sample at 670degrees C. The input had w-28 MHz and V(RMS) =10 V. The attenuation corresponds to about 2 db/echo or 0.5 db/cm. After a few echo pulses that saturate the detector, an exponential decay is observed until the 16th echo with a signal to noise ratio of about 1. His pulse is at an effective sonic distance of 64 cm from the transducer. Spurious reflexes arising from reflections from the side wall are observed between the 3rd and the 7th echo. The temperature of 670degrees was limited by the quartz sample rather than the bond. This newly investigated ultrasonic bond material allows for nondestructive testing of material to at least 670degrees C with a sensitivity comparing favorably to that at room temperature. Large sampl...