Browse Prior Art Database

High Density Chip Contactor

IP.com Disclosure Number: IPCOM000073974D
Original Publication Date: 1971-Feb-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Caccoma, GA: AUTHOR [+2]

Abstract

An etched contactor array of leads for probing semiconductor devices is fabricated such that the lead spacing limitations of the normal etching practice are overcome and a higher lead density is achieved.

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High Density Chip Contactor

An etched contactor array of leads for probing semiconductor devices is fabricated such that the lead spacing limitations of the normal etching practice are overcome and a higher lead density is achieved.

For each quadrant 1 of the contactor array, the fabrication process provides for the separate etching of lead frames 2 and 3 with six leads 4-9 and five leads 10-14, respectively. The spacing dimension between the leads is well within the existing etching limitations. Each frame 1 and 2 has locating holes 15, 16.

Supporting wedge 17 is machined from brass and a shim 18 of epoxy glass is fabricated. Shim 18 is epoxied to wedge 17 and this subassembly is located by dowel pin 20 in a bonding fixture 19. Locating holes 15 and 16 of lead frames 2, 3 are placed over locating pins 21, 22 of fixture 19. A pressure plate is located on top of frames 2 and 3 and a force applied so that frames 2 and 3 are intertwined.

With the pressure plate on fixture 19, an epoxy 23 is applied on the lead frames and wedge assembly. The fixture is placed in an oven and the epoxy cured until it hardens. The fixture with the wedge and lead assembly is located in an electron discharge machine and at a predetermined distance from the edge of the assembly the electron discharge machine cutting tool 24 severs the lead frames. Quadrant 1 is removed from fixture 19 and connecting webs 25 of frames 2 and 3 are sheared.

By placing the four quadrants of the array on contac...