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Browse Prior Art Database

Solder Joint Fatigue Tester

IP.com Disclosure Number: IPCOM000074119D
Original Publication Date: 1971-Mar-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Coombs, VD: AUTHOR [+2]

Abstract

Solder joints can be subjected to closely simulated field strains by using thermal expansion and contraction in applying cyclic displacements during fatigue testing. Two members 1, 2 are joined with solder at joint 3 which is to be tested. Member 1 is secured to stationary plate 4 fixed to support base 5 but electrically isolated by insulation 6. Member 2 is secured to movable plate 7 which is supported on pedestal 8 by a round rod 9. Plate 7 is attached to parallel expansion rods 10, 11 that have their respective base portions fastened through insulation 12 to base 5 so as to be electrically isolated. Rod 9 is free to roll on the pedestal surface and has a right angle portion 13 that moves vertically to indicate the rolling motion. Electrical contacts 14, 15 are placed at selected limits of travel of indicator 13.

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Solder Joint Fatigue Tester

Solder joints can be subjected to closely simulated field strains by using thermal expansion and contraction in applying cyclic displacements during fatigue testing. Two members 1, 2 are joined with solder at joint 3 which is to be tested. Member 1 is secured to stationary plate 4 fixed to support base 5 but electrically isolated by insulation 6. Member 2 is secured to movable plate 7 which is supported on pedestal 8 by a round rod 9. Plate 7 is attached to parallel expansion rods 10, 11 that have their respective base portions fastened through insulation 12 to base 5 so as to be electrically isolated. Rod 9 is free to roll on the pedestal surface and has a right angle portion 13 that moves vertically to indicate the rolling motion. Electrical contacts 14, 15 are placed at selected limits of travel of indicator 13.

In operation, an electric current is passed through parallel rods 10, 11 to produce heating and resultant expansion. This causes plate 7 to move toward stationary plate 4 and produce strain in solder joint 3. This motion also causes rod 9 to roll and move indicator 13 upward to touch a contact 14. An appropriate circuit is then energized to discontinue current flow through parallel rods 10, 11 so that cooling and contraction occur. Strain is thus reversed in the solder joint and indicator 13 moves downward toward contact 15. When the indicator touches the lower contact, the heating cycle is again initiated.

This testing devi...