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Browse Prior Art Database

Holding Circuit Part Components for Bonding

IP.com Disclosure Number: IPCOM000074133D
Original Publication Date: 1971-Mar-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Jackson, CR: AUTHOR

Abstract

A radiant energy bonding source comprises heat source 10 within elliptical reflector 11 suitably mounted at a work station and work table 12, located below reflector 11, comprising vacuum chamber 13 connected to a suitable vacuum pump. Circuit components, such as printed circuit board 15, and a flexible cable 16 are placed with their surfaces to be joined in contact and on the upper surface of chamber 13 along with enclosing sealing gasket 17 and rigid cover plate 18 having central opening 19 positioned to expose the bonding surfaces to energy from source 10. Transparent flexible holding sheet 20 is attached by clamping, bonding, or the like, to the top of plate 18 and completely covers opening 19.

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Holding Circuit Part Components for Bonding

A radiant energy bonding source comprises heat source 10 within elliptical reflector 11 suitably mounted at a work station and work table 12, located below reflector 11, comprising vacuum chamber 13 connected to a suitable vacuum pump. Circuit components, such as printed circuit board 15, and a flexible cable 16 are placed with their surfaces to be joined in contact and on the upper surface of chamber 13 along with enclosing sealing gasket 17 and rigid cover plate 18 having central opening 19 positioned to expose the bonding surfaces to energy from source 10. Transparent flexible holding sheet 20 is attached by clamping, bonding, or the like, to the top of plate 18 and completely covers opening 19. The vacuum applied to chamber 13 through openings 21 in the upper surface thereof pulls plate 18 firmly against gasket 17 and pulls on sheet 20 causing it to stretch downwardly through opening 19 to engage and apply pressure to board 15 and cable 16 to hold the surfaces to be bonded firmly together. Opening 19 in plate 18 is selected to be of a size suitable to localize the application of the holding pressure from sheet 20 directly to the surfaces to be bonded, while plate 18 otherwise prevents pressure from being applied to other areas of the circuit board 15 where semiconductor components, or the like, may previously have been bonded.

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