Browse Prior Art Database

Electromagnetic Measuring of Adhesion of Metal Lines

IP.com Disclosure Number: IPCOM000074248D
Original Publication Date: 1971-Apr-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Phillips, RP: AUTHOR [+2]

Abstract

This method allows for the quantitative measurement of adhesion between metal lines and nonconductive substrates.

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Electromagnetic Measuring of Adhesion of Metal Lines

This method allows for the quantitative measurement of adhesion between metal lines and nonconductive substrates.

Sample 1, a metal line adhering to insulating substrate 2, is placed in a magnetic field B parallel to the surface of sample 1. When a current 1 is passed through sample 1, a magnetic force F acts on line 1 in a direction away from the substrate surface. Force F is maximum when I is perpendicular to the magnetic field B.

If the length of sample 1 is L, the width W and the height H, the force F is (jWH/I) LB and the stress, S, is F/WL or jHB, where j is the current density.

The adhesion test is made, either by fixing current 1 and gradually increasing field B, or by fixing B and increasing I, and monitoring the variable until sample 1 is pulled from substrate 2.

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