Browse Prior Art Database

Removing Contaminants From Wafer and Mask Surfaces

IP.com Disclosure Number: IPCOM000074249D
Original Publication Date: 1971-Apr-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lorenz, PK: AUTHOR

Abstract

This method provides for improved reliability of masks used in integrated circuit manufacturing by removing foreign contaminants from contacting surfaces between masks and wafers.

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Removing Contaminants From Wafer and Mask Surfaces

This method provides for improved reliability of masks used in integrated circuit manufacturing by removing foreign contaminants from contacting surfaces between masks and wafers.

A thin coating of a relatively soft organic polymer is placed on the surface of a wafer or glass blank. Contacting the coated surface to the wafers or masks to be cleaned allows foreign material to embed in the soft film and be safely removed. The method improves the quality of wafers processed and increases mask life.

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